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MAXIM New Products - MAX17503EVKITA & MAX21002
2013-12-02
MAX17503EVKITA

Evaluation Kit for the MAX17503


Description

The MAX17503 3.3V output evaluation kit (EV kit) provides a proven design to evaluate the MAX17503 high-voltage, high-efficiency, synchronous step-down DC-DC converter. The EV kit is preset for 3.3V output at load currents up to 2.5A and features a 450kHz switching frequency for optimum efficiency and component size. The EV kit features adjustable input undervoltage lockout, adjustable soft-start, open-drain active-low RESET signal, and external frequency synchronization.

Key Features

  • Operates from a 5V to 60V Input Supply
  • 3.3V Output Voltage
  • Up to 2.5A Output Current
  • 450kHz Switching Frequency
  • Enable/UVLO Input, Resistor-Programmable UVLO Threshold
  • Adjustable Soft-Start Time
  • MODE Pin to Select Among PWM, PFM, or DCM Modes
  • Open-Drain RESET Output
  • External Frequency Synchronization
  • Overcurrent and Overtemperature Protection
  • Proven PCB Layout
  • Fully Assembled and Tested

MAX21002

Ultra-Accurate, Low Power, Dual-Axis Digital Output Gyroscope

Industry's Smallest Footprint Package (3mm x 3mm LGA16) and a Low Power Supply (1.8V) Gyroscope

Description

The MAX21002 is a low-power, low-noise, dual-axis angular rate sensor that delivers unprecedented accuracy and sensitivity over temperature and time. It operates with a supply voltage as low as 1.71V for minimum power consumption. It includes a sensing element and an IC interface that provides the measured angular rate to the external world through a digital interface (I2C/SPI).
The IC has a full scale of ±31.25/±62.50/±125/±250/ ±500/±1000 degrees per second (dps) and measures rates with a finely tunable user-selectable bandwidth. The high ODR and the large BW, the low noise at highest FS, together with the low phase delay, make the IC suitable for optical image stabilization (OIS) applications.
The IC is a highly integrated solution available in a compact 3mm x 3mm x 0.9mm plastic land grid array (LGA) package and does not require any external components other than supply bypass capacitors. It can operate over the -40°C to +85°C temperature range.

Key Features

  • Minimum Overall Footprint
    • Industry’s Smallest and Thinnest Package for Portable Devices (3mm x 3mm x 0.9mm LGA)
    • No External Components
  • Unique Low-Power Capabilities
    • Low Operating Current Consumption (5.1mA typ)
    • Eco Mode Available at 100Hz with 3.0mA (typ)
    • 1.71V (min) Supply Voltage
    • Standby Mode Current 2.7mA (typ)
    • 8.5µA (typ) Power-Down Mode Current
    • High PSRR and DC-DC Converter Operation
    • 45ms Turn-On Time from Power-Down Mode
    • 5ms Turn-On Time from Standby Mode
  • OIS Suitability
    • Minimum Phase Delay (~3° at 10Hz)
    • High Bandwidth (400Hz)
    • High ODR (10kHz)
    • Low Noise (8mdps/ typ)
  • Unprecedented Accuracy
    • Embedded Digital-Output Temperature Sensor
    • Automatic Temperature Compensation
    • Ultra-Stable Over Temperature and Time
    • Factory Calibrated
  • High-Speed Interface
    • I2C Standard (100kHz), Fast (400kHz), and High-Speed (3.4MHz) Serial Interface
    • 10MHz SPI Interface
    • Reduces AP Load
    • Enables UI/OIS Serial Interface Multiplexing
  • Flexible Embedded FIFO
    • Size: 512 Bytes (256 x 16 Bits)
    • Single-Byte Reading Available
    • Four Different FIFO Modes Available
    • Reduces AP Load
  • High Configurability
    • Integrated Digitally Programmable Low- and Highpass Filters
    • Independently Selectable Data ODR and Interrupt ODR
    • 6 Selectable Full Scales (31.25/62.5/125/250/500/1000 dps)
    • 256-Selectable ODR
  • Flexible Interrupt Generator
    • Two Digital Output Lines
    • Two Independent Interrupt Generators
    • Eight Maskable Interrupt Sources Each
    • Configurable as Latched/Unlatched/Timed
    • Embedded Independent Angular Rate Comparators
    • Independent Threshold and Duration
    • Level/Pulse and OD/PP Options Available
  • Flexible Data Synchronization Pin
    • External Wake-Up
    • Interrupt Generation
    • Single Data Capture Trigger
    • Multiple Data Capture Trigger
    • LSB Data Mapping
  • Unique 48-Bit Serial Number as Die ID
  • High-Shock Survivability (10,000 G-Shock)
 

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